First Rehm exposition at an exhibition in Germany

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It all starts again! Several trade shows have already been held in China and Russia in recent months, and now the first exhibitions have begun to take place in Germany as well. Rehm Thermal Systems plans to participate in them: these are Bondexpo in Stuttgart and Productronica in Munich. The Rehm team looks forward to your visit!

Bondexpo has a reputation as the leading trade fair for adhesive technology and an important industry platform for the bonding and bonding technology sector. From 5 to 8 October, Rehm Thermal Systems will also be present at the Stuttgart Exhibition Center with its portfolio of products in the areas of dispensing systems, adhesive technologies and application methods. Bondexpo clearly and consistently focuses on the bonding / bonding process chain through bonding, pouring, sealing and foaming, offering cost-effective detailed and system solutions for bonding and bonding a wide variety of materials – today and in the future.

When handling sensitive electronic components, the electronics industry is constantly faced with new requirements. Rehm Thermal Systems’ solutions and systems, which will be showcased at Productronica in Munich , are designed to meet these demands. This leading international trade fair for the development and manufacture of electronics will take place this year from 16 to 19 November at the Munich Exhibition Center.

Later we will provide you with additional information about the systems that will be presented at Bondexpo and Productronica. We look forward to welcoming you to our stands in Stuttgart and Munich!

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